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STATS ChipPAC Will Offer 300mm Bumping Services Through Tool Consignment to TSMC (PR Newswire via Yahoo! Finance)
To address growing demand for advanced flip chip applications, STATS ChipPAC Ltd. , will offer 300mm wafer bumping service to Taiwan Semiconductor Manufacturing Company customers in the third quarter of 2005.

STATS ChipPAC Expands Flip Chip Portfolio With 300mm Wafer Bumping (PR Newswire via Yahoo! Finance)
STATS ChipPAC Ltd. , today announced it will offer 300mm electroplated wafer bumping services in the third quarter of 2005 to complete the Company's full turnkey service offering for advanced flip chip applications.

BETTING THE FARM:Landowner says track only way he can make money from dryland (Greeley Tribune Online)
Once a week, on a farm about 10 miles southeast of La Salle, hundreds of people line a dirt track to talk to friends, forget their jobs and watch the horses thunder down the quarter-mile track.

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